Our Silver Ink Expertise:

Screen Printable Material

Conductive/Dielectric Paste

Functional/Carbon Paste

Multi Layer Printing

Printable Substrates

Printed Circuits

PR Printing and Etching

Priting silver pattern on flex and/or rigid substrates

Insulation and Conductive patterns on 3D substrates

Printed Circuit for Display / Lightening

Sensors for 4th Industrial Revolution

NFC, BLT Base Sensor Tags

Impact Sensors, Pressure Sensitivei Ink

Piezo Sensor for special application

ODM Products

RFID, BLE Embedded Sensors

Item Labeling

LF/HF/NFC/UHF

Etched and Printed Antenna

Economic ACP

RFID Label, PVC Card, RFID ICs

Component Trading

Substrates, Semiconductors, NFC cards, etc

Supply PET, PI with/out metal layers 

Silver Ink

Material products

ESD INK

for IPS Display Panel, Dispensing & Jetting

Our Advantages:

1. High Dispersion

Stable phase for more than

3 months without precipitation

2. High Workability 

No nozzle clogging & Uniform dot size

3. High ESD Performance

No crack

4. High Elasticity

Brand new formulated ink for high shrink substrate

DPH

(Direct Patterned Heatsink) - Screen Printing

Our Advantages:

1. High Performance

Excellent heat dis-passing capacity

2. High Insulation

High voltage drop & Dense Structures

3. Strong Adhesion

Strong adhesion with LED chip

4. Minimize Heatsink Size

High fuel efficiency

MMI

(Metal Mesh Ink) - Screen Printing

Our Advantages:

1. High TI

Easy to fill Sensor & Trace

2. High Conductivity

Lowest resistivity​ & Low paste consumption

3. Strong Adhesion

Strong Adhesion after curing

4. High Workability

Easy to wash

PPP

(Pad Print Paste) - Stamping & Pad Printing

Our Advantages:

1. Solvent Type

Dries under Room Temperature

2. UV Type

High speed curing (around 350mJ/cm^3)

3. Loww WVTR

< 50 g/m^3 for 24 hrs

4. Repairability

Strong Adhesion and Repairability

ACP

(Anisotropic Conductive Paste) - Screen Printing & Jetting

Our Advantages:

1. Economic Solution

Ni based conductors

2. Abundant Reference

Adopted more than 100 million products

Used for Smartphone components

3.Workability

Hot Press /  Quick Press Process

EPI

(Electrode Protection Ink) - Screen Printing & Slot Die Coating

Our Advantages:

1. Solvent Type

Dries under Room Temperature

2. UV Type

High Speed Curing (Around 350mJ/cm^3)

Acryl based

3. Low WVTR

< 50 g/m^3 for 24 hrs

4. Repairability

Strong Adhesion and Repairability

CM Technology GmbH

Kelkheim, Germany

©2017 by CM Technology GmbH